Soldering Process Monitor
Customer's Requirement:
Soldering temperature monitoring of a circuit board panel with an IR camera.
An existing solder process monitoring software at the customer's shall be expanded.
Project Scope:
Implementation:
- Reading the thermal image from the IR camera
- Processing component informations of the pic-and-place machine
- Calculating the space occupied by components ( = ROI)
- Determination of highest temperature inside the ROI and transmitting as process value to the soldering process control
- Warn on overheating of damageable components
- Calibration through camara picture
- Drawing the ROI into the current thermal image
- Automatic import of component data
- Displaying a histogram of the temperature distribution
Development Environment / Software:
- VS 2008 C# for PC-Software
- NI Automation Studio 8.6.1 (Components) for included visualisations
Tasks:
- Analysis and expansion of existing software
- Tight collaboration with the customer's software department to be able to use their required standard components
- Implementing the software and launch direct at the customer's site
- Software documentation and manual